Lohmann D, Spinczyk O (2006)
Publication Type: Conference contribution
Publication year: 2006
Publisher: ACM Press
Edited Volumes: Proceedings of the Conference on Object-Oriented Programming Systems, Languages, and Applications, OOPSLA
City/Town: New York
Pages Range: 740--742
Conference Proceedings Title: OOPSLA '06: Companion to the 21st ACM SIGPLAN conference on Object-oriented programming languages, systems, and applications
Event location: Portland, Oregon, USA
ISBN: 1-59593-491-X
URI: http://www4.informatik.uni-erlangen.de/~lohmann/download/OOPSLA06_Lohmann.pdf
AspectC++ is a general purpose aspect-oriented language extension to C++. It is aimed to bring fully-fledged aspect-oriented programming (AOP) support in areas with strong demands on runtime efficiency and code density. This makes it possible to exploit the power of AOP for the domain of (deeply) embedded systems, where computation speed and available memory resources are strictly limited. AOP concepts are particularly useful for the development of scalable embedded system product lines. This will be demonstrated by a real world example: a small embedded device equipped with meteorological sensors and an 8-bit micro-controller running AspectC++ code. By covering the complete build cycle of configuration, compilation and installation, participants will understand, how easy it is to integrate AspectC++ with an existing tool chain. A presentation of the AspectC++ tools for Eclipse and the pure::variants variant-management system rounds up the demonstration.
APA:
Lohmann, D., & Spinczyk, O. (2006). Developing embedded software product lines with AspectC++. In OOPSLA '06: Companion to the 21st ACM SIGPLAN conference on Object-oriented programming languages, systems, and applications (pp. 740--742). Portland, Oregon, USA: New York: ACM Press.
MLA:
Lohmann, Daniel, and Olaf Spinczyk. "Developing embedded software product lines with AspectC++." Proceedings of the Conference on Object Oriented Programming Systems Languages and Applications, Portland, Oregon, USA New York: ACM Press, 2006. 740--742.
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