Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

Glocker E, Boppu S, Chen Q, Schlichtmann U, Teich J, Schmitt-Landsiedel D (2014)

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2014

Journal

Advances in Radio Science Copernicus Publications

Book Volume: 12

Pages Range: 103-109

DOI: 10.5194/ars-12-103-2014

Abstract

This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

Authors with CRIS profile

Srinivas Boppu Sonderforschungsbereich/Transregio 89 Invasives Rechnen Jürgen Teich Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)

Involved external institutions

Technische Universität München (TUM) DE Germany (DE)

How to cite

APA:

Glocker, E., Boppu, S., Chen, Q., Schlichtmann, U., Teich, J., & Schmitt-Landsiedel, D. (2014). Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs). Advances in Radio Science, 12, 103-109. https://doi.org/10.5194/ars-12-103-2014

MLA:

Glocker, E., et al. "Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)." Advances in Radio Science 12 (2014): 103-109.

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