Nisznansky M, Ziegler C, Schmidt LP, Hocke R, Wohlgemuth O (2003)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2003
Publisher: International Society for Optical Engineering; 1999
Edited Volumes: Proceedings of SPIE - The International Society for Optical Engineering
Pages Range: 47-52
Conference Proceedings Title: Proceedings of IMAPS Conference and Exhibition on Ceramic Interconnect Technology
Event location: Denver, Colorado, USA
Substrate integrated package based on LTCC-technology with bandwidth of 50 GHz was designed. Full wave electromagnetic analysis of all included interconnects was performed and verified by measurement. Our work is especially focused on novel interconnects like flip-chip and differential transmission lines which enable an increase of bandwidth of the components. For the design of high speed SiGe-chips which will be embedded in LTCC-packages and modules it is interesting to know the influence of wire-bonds and flip-chip interconnects on module performance. Therefore equivalent circuit models were developed for these two typical structures that can be used in chip design tools like CADENCE. The behavior of interconnects were investigated not only in frequency domain but in time domain as well. As digital signals are processed an estimation of their distortion in the time domain is needed. Hence eye-diagrams were calculated from simulated data. Important digital signal characteristics like eye-opening and jitter can be estimated from this diagram. From the presented results we can see that the designed interconnects for LTCC-packages fulfill the requirements on bandwidth and minimize signal distortion.
APA:
Nisznansky, M., Ziegler, C., Schmidt, L.-P., Hocke, R., & Wohlgemuth, O. (2003). Broadband Electrical Design and Modelling of Packages Integrated in LTCC-Substrate. In Proceedings of IMAPS Conference and Exhibition on Ceramic Interconnect Technology (pp. 47-52). Denver, Colorado, USA: International Society for Optical Engineering; 1999.
MLA:
Nisznansky, Martin, et al. "Broadband Electrical Design and Modelling of Packages Integrated in LTCC-Substrate." Proceedings of the Ceramic Interconnect Technology: The Next Generation, Denver, Colorado, USA International Society for Optical Engineering; 1999, 2003. 47-52.
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