2D transmission imaging with a crossed-array configuration for defect detection

Koch A, Gruber S, Scharrer T, Fendt K, Lerch R, Ermert H (2012)


Publication Language: English

Publication Status: Published

Publication Type: Conference contribution, Conference Contribution

Publication year: 2012

Pages Range: 36-39

Article Number: 6562075

Conference Proceedings Title: 2012 IEEE International Ultrasonics Symposium Proceedings

Event location: Dresden DE

ISBN: 9781467345613

DOI: 10.1109/ULTSYM.2012.0010

Abstract

Two-dimensional time of fight and attenuation measurements offer unique opportunities in nondestructive ultrasound testing for defect detection. However, unavailability or costs for 2D matrix transducers usually require a mechanical scanning procedure with a single element transducer to acquire 2D projections. This time and cost intensive process is not applicable for high speed testing of e.g. low cost devices. We propose a concept of a crossed-array configuration for 2D transmission imaging in terms of time of fight and attenuation measurements. A mechanical setup and a data acquisition system have been developed to evaluate the potential of this concept. Our results show, that ultrasound crossed-array transmission imaging has a great potential in terms of time of fight and attenuation measurements for defect detection in non-destructive testing, e.g. for detection of delaminations. With an appropriate data acquisition system transmission images can be acquired with frames rates in the kHz range. Therefore, crossed-array transmission imaging is a unique, cost efficient procedure with a good resolution for high speed testing in industrial applications. © 2012 IEEE.

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APA:

Koch, A., Gruber, S., Scharrer, T., Fendt, K., Lerch, R., & Ermert, H. (2012). 2D transmission imaging with a crossed-array configuration for defect detection. In 2012 IEEE International Ultrasonics Symposium Proceedings (pp. 36-39). Dresden, DE.

MLA:

Koch, Andreas, et al. "2D transmission imaging with a crossed-array configuration for defect detection." Proceedings of the 2012 IEEE International Ultrasonics Symposium, IUS 2012, Dresden 2012. 36-39.

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