Modeling and simulation of curing and damage in thermosetting adhesives

Mergheim J, Possart G, Steinmann P (2013)

Publication Type: Journal article

Publication year: 2013

Journal

Journal of Adhesion Taylor & Francis: STM, Behavioural Science and Public Health Titles / Taylor & Francis

Publisher: Taylor & Francis: STM, Behavioural Science and Public Health Titles / Taylor & Francis

Book Volume: 89

Pages Range: 111

Authors with CRIS profile

Julia Mergheim Gunnar Possart Lehrstuhl für Technische Mechanik (LTM) Paul Steinmann Lehrstuhl für Technische Mechanik (LTM)

Related research project(s)

Kontinuumsmechanische Modellierung und Simulation der Aushärtung und Inelastizität von Polymeren sowie Interphasen in Klebverbunden Aug. 1, 2008 - Dec. 31, 2025

How to cite

APA:

Mergheim, J., Possart, G., & Steinmann, P. (2013). Modeling and simulation of curing and damage in thermosetting adhesives. Journal of Adhesion, 89, 111.

MLA:

Mergheim, Julia, Gunnar Possart, and Paul Steinmann. "Modeling and simulation of curing and damage in thermosetting adhesives." Journal of Adhesion 89 (2013): 111.

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