Röhrl FX, Sammer R, Jakob J, Bogner W, Weigel R, Hassel U, Zorn S (2017)
Publication Language: English
Publication Status: Accepted
Publication Type: Conference contribution, Conference Contribution
Future Publication Type: Conference contribution
Publication year: 2017
URI: http://ieeexplore.ieee.org/document/8230878/
DOI: 10.23919/EuMC.2017.8230878
The fabrication of passive RF structures in the
millimeter wave frequency range with conventional printed
circuit technology is subjected to some disadvantages (available
design rules, dimensional accuracy and tolerances) compared to
ceramic circuit carriers. The here presented SPE (sequential pre
etching) process technology allows a significant reduction of these
disadvantages, without diminishing the robustness of the PCB
against environmental influences (IPC-A-600 class 3). The
tolerance of the up to now dominating etching process is reduced
from ±15 μm (at a copper height of 35 μm) to ±5 μm (at a copper
height of 15 μm). For filters the new technology provides two
benefits. Due to the lower copper thickness, the permitted design
rules are significantly improved (line/space 50/50 μm at all layers
– even at electroplated copper layers). Therefore structures with
minimized dimensions can be realized. In addition the reduced
etching tolerance allows fabricating filters with accurate and
constant filter edges. In order to demonstrate the advantages, a
high-slope SIW (substrate integrated waveguide) band-pass filter
in the V-Band is presented. It is shown how the characteristic
and tolerances of the filter are changed positively by the SPE
technology.
APA:
Röhrl, F.X., Sammer, R., Jakob, J., Bogner, W., Weigel, R., Hassel, U., & Zorn, S. (2017). Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications - A method to combine low tolerances and low prices on standard pcb substrates. In Proceedings of the European Microwave Conference. Nürnberg, DE.
MLA:
Röhrl, Franz Xaver, et al. "Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications - A method to combine low tolerances and low prices on standard pcb substrates." Proceedings of the European Microwave Conference, Nürnberg 2017.
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