Influence of Ni Solute segregation on the intrinsic growth stresses in Cu(Ni) thin films

Kaub TM, Felfer P, Cairney JM, Thompson GB (2016)

Publication Status: Published

Publication Type: Journal article

Publication year: 2016

Journal

Scripta Materialia Elsevier

Publisher: Elsevier

Book Volume: 113

Pages Range: 131-134

DOI: 10.1016/j.scriptamat.2015.10.010

Abstract

Using intrinsic solute segregation in alloys, the compressive stress in a series of Cu(Ni) thin films has been studied. The highest compressive stress was noted in the 5 at.%Ni alloy, with increasing Ni concentration resulting in a subsequent reduction of stress. Atom probe tomography quantified Ni's Gibbsian interfacial excess in the grain boundaries and confirmed that once grain boundary saturation is achieved, the compressive stress was reduced. This letter provides experimental support in elucidating how interfacial segregation of excess adatoms contributes to the post-coalescence compressive stress generation mechanism in thin films. (C) 2015 Elsevier Ltd. All rights reserved.

Authors with CRIS profile

Peter Felfer Professur für Atom Probe Tomography

Additional Organisation(s)

Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)

Involved external institutions

University of Sydney (USYD) AU Australia (AU) University of Alabama in Huntsville (UAH) US United States (USA) (US)

How to cite

APA:

Kaub, T.M., Felfer, P., Cairney, J.M., & Thompson, G.B. (2016). Influence of Ni Solute segregation on the intrinsic growth stresses in Cu(Ni) thin films. Scripta Materialia, 113, 131-134. https://doi.org/10.1016/j.scriptamat.2015.10.010

MLA:

Kaub, T. M., et al. "Influence of Ni Solute segregation on the intrinsic growth stresses in Cu(Ni) thin films." Scripta Materialia 113 (2016): 131-134.

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