Nils Thielen

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing (2021) Thielen N, Jiang Z, Schmidt K, Seidel R, Voigt C, Reinhardt A, Franke J Conference contribution Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks (2020) Schmidt K, Thielen N, Voigt C, Seidel R, Franke J, Milde Y, Bonig J, Beitinger G Conference contribution Data Mining System Architecture for Industrial Internet of Things in Electronics Production (2020) Seidel R, Hassan Amada M, Fuchs J, Thielen N, Schmidt K, Voigt C, Franke J Conference contribution Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors (2020) Seidel R, Thielen N, Schmidt K, Voigt C, Franke J Conference contribution A Machine Learning Based Approach to Detect False Calls in SMT Manufacturing (2020) Thielen N, Werner D, Schmidt K, Seidel R, Reinhardt A, Franke J Conference contribution Thermische Beurteilung von THT-Lötstellendesigns für die IPC-konforme Kontaktierung durch Selektivwellenlöten (2020) Seidel R, Thielen N, Voigt C, Franke J Conference contribution, Original article Maschinelles Lernen in der Elektronikproduktion: Herausforderungen und Anwendungsmöglichkeiten (2020) Thielen N, Schmidt K, Seidel R, Franke J Conference contribution, Conference Contribution Ein Ansatz zu Qualitätsvorhersage mittels intelligenter SMT-Lötstelleninspektion durch den Einsatz von Maschinellem Lernen (2020) Schmidt K, Bönig J, Beitinger G, Thielen N, Franke J Conference contribution, Conference Contribution Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression (2020) Seidel R, Leibold F, Thielen N, Franke J Conference contribution Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement (2020) Seidel R, Volland J, Thielen N, Voigt C, Franke J Conference contribution, Original article