Aarief Hussain Syed Khaja



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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Abstract

Journal

Characterization and Optimization of Sn-Cu TLPS Interconnects for High Temperature Power Electronics through In-Situ-X-Ray Investigations (2016) Syed Khaja AH, Klemm A, Zerna T, Franke J Conference contribution, Conference Contribution Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects (2016) Syed Khaja AH, Walawski D, Stoll T, Franke J Conference contribution, Conference Contribution Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers (2016) Syed Khaja AH, Franke J Conference contribution, Conference Contribution Investigations in Selective Laser Melting as Manufacturing Technology for the Production of High-temperature Mechatronic Integrated Devices (2016) Syed Khaja AH, Stoll T, Franke J Conference contribution Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers (2016) Syed Khaja AH, Kästle C, Franke J Conference contribution, Conference Contribution Influential parameters in the development of Transient Liquid Phase Soldering (TLPS) as a new interconnect system for high power lighting applications (2015) Syed Khaja AH, Franke J Conference contribution, Conference Contribution Investigations in the optimization of power electronics packaging through additive plasma technology (2015) Franke J, Syed Khaja AH, Schramm R, Ochs R Conference contribution, Conference Contribution A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics (2015) Syed Khaja AH, Hörber J, Gruber C, Franke J Conference contribution, Conference Contribution An exergy-based analysis of temperature profiles for an over-pressure reflow oven technology (2015) Esfandyari A, Landskrone T, Syed Khaja AH, Franke J Conference contribution, Conference Contribution Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications (2015) Syed Khaja AH, Schwarz D, Franke J Conference contribution, Conference Contribution
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