Prof. Dr. Wolfgang Blum

Technische Fakultät

Dynamic recovery in nanocrystalline Ni (2015) Sun Z, Van Petegem S, Cervellino A, Durst K, Blum W, Van Swygenhoven H Journal article Correct Interpretation of Creep Rates: A Case Study of Cu (2015) Blum W, Dvorak J, Kral P, Eisenlohr P, Sklenicka V Journal article Effect of grain refinement by ECAP on creep of pure Cu (2014) Blum W, Dvorak J, Kral P, Eisenlohr P, Sklenicka V Journal article What is "stationary" deformation of pure Cu? (2014) Blum W, Dvorak J, Kral P, Eisenlohr P, Sklenicka V Journal article, Review article Influence of grain boundaries on the deformation resistance: Insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP (2013) Bach J, Liebig JP, Höppel HW, Blum W Journal article Temperature dependence of the strength of fine- and ultrafine-grained materials (2011) Schneibel JH Journal article Control of dynamic recovery and strength by subgrain boundaries - Insights from stress-change tests on CaF2 single crystals (2011) Mekala SR, Eisenlohr P, Blum W Journal article Deformation resistance in the transition from coarse-grained to ultrafine-grained Cu by severe plastic deformation up to 24 passes of ECAP (2011) Blum W, Li YJ, Zhang Y, Wang JT Journal article Erratum: A simple dislocation model of deformation resistance of ultrafine-grained materials explaining Hall-Petch strengthening and enhanced strain rate sensitivity (Acta Materialia (2009) 57 (1966-1974)) (2011) Blum W, Zeng XH Journal article, Erratum Structure evolution and deformation resistance in production and application of ultrafine-grained materials - The concept of steady-state grains (2011) Blum W, Eisenlohr P Journal article