Prof. Dr. Wolfgang Blum

Technische Fakultät

The influence of long-term annealing at room temperature on creep behaviour of ECAP-processed copper (2017) Blum W Journal article Interpretation of unloading tests on nanocrystalline Cu in terms of two mechanisms of deformation (2016) Blum W, Eisenlohr P, Hu J Journal article Thermally activated flow in soft and hard regions: Getting information on work hardening strain and recovery strain from rate change tests (2015) Blum W, Eisenlohr P, Prell M, Durst K Journal article In situ study of microstructure and strength of severely predeformed pure Cu in deformation at 573K (2015) Blum W, Dvorak J, Kral P, Petrenec M, Eisenlohr P, Sklenicka V Journal article Thermally activated flow in soft and hard regions: Getting information on work hardening strain and recovery strain from rate change tests (2015) Blum W, Eisenlohr P, Prell M, Durst K Journal article Dynamic recovery in nanocrystalline Ni (2015) Sun Z, Van Petegem S, Cervellino A, Durst K, Blum W, Van Swygenhoven H Journal article Correct Interpretation of Creep Rates: A Case Study of Cu (2015) Blum W, Dvorak J, Kral P, Eisenlohr P, Sklenicka V Journal article Effect of grain refinement by ECAP on creep of pure Cu (2014) Blum W, Dvorak J, Kral P, Eisenlohr P, Sklenicka V Journal article What is "stationary" deformation of pure Cu? (2014) Blum W, Dvorak J, Kral P, Eisenlohr P, Sklenicka V Journal article, Review article Influence of grain boundaries on the deformation resistance: Insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP (2013) Bach J, Liebig JP, Höppel HW, Blum W Journal article