Christopher Kästle

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers (2016) Syed Khaja AH, Kästle C, Franke J Conference contribution, Conference Contribution Operation-oriented One-piece-flow Manufacturing: Autonomous and Smart Systems as Enabler for a Full-meshed Production Network (2016) Scholz M, Kolb S, Kästle C, Franke J Conference contribution, Conference Contribution Evaluation of Influencing Factors on the Heavy Wire Bondability of Plasma Printed Copper Structures (2015) Kästle C, Losch T, Franke J Conference contribution, Conference Contribution Prospects of wire bonding as an approach for contacting additive manufactured Aerosol Jet printed structures (2015) Kästle C, Hörber J, Öchsner F, Franke J Conference contribution, Conference Contribution A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications (2015) Syed Khaja AH, Kästle C, Müller M, Franke J Journal article Comparative Analysis of the Process Window of Aluminum and Copper Wire Bonding for Power Electronics Applications (2014) Kästle C, Franke J Conference contribution, Conference Contribution Design and solder process optimization in MID technology for high power applications (2014) Syed Khaja AH, Kästle C Authored book, Volume of book series Investigations on Ultrasonic Copper Wire Wedge Bonding for Power Electronics (2013) Kästle C, Syed Khaja AH, Reinhardt A, Franke J Conference contribution, Conference Contribution Optimized thin-film diffusion soldering for power-electronics production (2013) Syed Khaja AH, Kästle C, Reinhardt A, Franke J Conference contribution, Conference Contribution Reliable packaging technologies for power electronics: Diffusion soldering and heavy copper wire bonding (2013) Syed Khaja AH, Kästle C, Franke J Conference contribution, Conference Contribution