Dr. Michael Jank



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Sub-Kelvin thermometry for evaluating the local temperature stability within in situ TEM gas cells (2022) Fritsch B, Wu M, Hutzler A, Zhou D, Spruit R, Vogl L, Will J, et al. Journal article Ultrathin and flexible sensors for pressure and temperature monitoring inside battery cells (2022) Dreher V, Joch D, Kren H, Schwarberg J, Jank MP Conference contribution Embedding Solutions for vertical SiC and GaN Power Devices (2022) Bach HL, Huang A, Teng Y, Rauh H, Schletz A, Jank MP, März M Conference contribution Modelling the Radiolysis of Silver Nitrate Solutions in presence of Bromide Ions in Liquid-Phase Transmission Electron Microscopy (2021) Taherkhani M, Fritsch B, Jank M, Spiecker E, Hutzler A Journal article, Original article Beam-induced heating at low electron fluxes during liquid phase transmission electron microscopy (2021) Fritsch B, Hutzler A, Wu M, Vogl L, Jank M, März M, Spiecker E Journal article, Original article Direct Manipulation of Nanostructures Utilizing Donut-Shaped Potential Wells during Liquid-Phase Transmission Electron Microscopy (2021) Hutzler A, Fritsch B, Branscheid R, Wu M, Jank M, Spiecker E Conference contribution Accessing local electron-beam induced temperature changes during in situ liquid-phase transmission electron microscopy (2021) Fritsch B, Hutzler A, Wu M, Khadivianazar S, Vogl L, Jank M, März M, Spiecker E Journal article, Letter From Cyclopentasilane to Thin-Film Transistors (2021) Gerwig M, Ali AS, Neubert D, Polster S, Bohme U, Franze G, Rosenkranz M, et al. Journal article, Original article A Fully Integrated Ferroelectric Thin-Film-Transistor – Influence of Device Scaling on Threshold Voltage Compensation in Displays (2021) Lehninger D, Ellinger M, Ali T, Li S, Mertens K, Lederer M, Olivio R, et al. Journal article Integration of printed electronics with potted power electronic modules (2020) Zimmermann V, Zörner A, Chen W, Yu Z, Jank M, Bayer C, Schletz A, März M Conference contribution