Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Research facility
Location:
Erlangen,
Germany (DE)
ISNI: 0000000104810543
ROR: https://ror.org/04q5rka56
Mechatronische Integration von Hochleistungselektronik in Komponenten des Antriebsstrangs von Hybridfahrzeugen (2007)
März M, Eckardt B, Schletz A
Conference contribution
Audio Watermarking Using Subband Modulation Spectra (2007)
Disch S, Herre J, Kammerl J
Conference contribution, Conference Contribution
Active Fuse (2006)
Berberich SEB, März M, Beuer S, Ryssel H
Conference contribution
Extracting activation and compensation ratio from aluminum implanted 4H-SiC by modeling of resistivity measurements (2006)
Rambach M, Frey L, Bauer A, Ryssel H
Authored book, Volume of book series
Creation of E-Learning Content for Microelectronics Manufacturing (2006)
Oechsner R, Pfeffer M, Pfitzner L, Ryssel H, Beer K, Boldin M, de Mey B, et al.
Conference contribution
System integration in automotive power systems (2005)
Gerber M, März M
Conference contribution
Wafer scale characterization of interface state densities without test structures by photocurrent analysis (2005)
Rommel M, Groß M, Frey L, Bauer A, Ryssel H
Conference contribution, Conference Contribution
Triple trench gate IGBTs (2005)
Berberich SE, Bauer A, Frey L, Ryssel H
Conference contribution, Conference Contribution
Thin HfxTiySixO films with varying Hf to Ti contents as candidates for high-k dielectrics (2005)
Bauer A, Paskaleva A, Lemberger M, Frey L, Ryssel H
Conference contribution, Conference Contribution
High-k Hafnium Silicate Films on Silicon and Germanium Wafers by MOCVD Using a Single-Source Precursor (2005)
Lemberger M, Schön F, Dirnecker T, Jank M, Paskaleva A, Bauer A, Frey L, Ryssel H
Book chapter / Article in edited volumes