Technische Hochschule Nürnberg "Georg Simon Ohm"

University / College


Location: Nürnberg, Germany (DE) DE

ISNI: 0000000097214128

ROR: https://ror.org/00nggaz43

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Anonymous online cognitive behavioral therapy for sleep disorders in shift workers—a study protocol for a randomized controlled trial (2021) Retzer L, Feil M, Reindl R, Richter K, Lehmann R, Stemmler M, Graessel E Journal article Absolute spectral backscatter measurements of large-core multimode PMMA polymer optical fibers (2021) Dengler SA, Engelbrecht R, Schmauß B Journal article Evaluation of detatchable board-to-board interconnects on screen printed electronic structures (2021) Schirmer J, Huemmer M, Klauss M, Neermann S, Reichenberger M, Franke J Journal article Large-scale geothermal collector systems for 5th generation district heating and cooling networks (2021) Zeh R, Ohlsen B, Philipp D, Bertermann D, Kotz T, Jocić N, Stockinger V Journal article Segmentation of Photovoltaic Module Cells in Uncalibrated Electroluminescence Images (2021) Deitsch S, Buerhop-Lutz C, Sovetkin E, Steland A, Gallwitz F, Maier A, Rieß C Journal article, Original article Conformable Electronics: Thermoforming and Injection Molding of Electronic Components (2021) Schirmer J, Reichenberger M, Neermann S, Franke J Conference contribution Review-based Selection Recommendation for Galvanically Isolated DC/DC Converters Designed for a Wide Input Voltage Range (2021) Gerstner M, März M, Dietz A Conference contribution Utilizing rare-earth-elements luminescence and vibrational-spectroscopies to follow high pressure densification of soda–lime glass (2021) Werr F, Yusim W, Bergler M, Shcheka S, Lenhart A, de Ligny D Journal article A No-Code Platform for Tie Prediction Analysis in Social Media Networks (2021) Schötteler S, Laumer S, Schuhbauer H, Scheidthauer N, Seeberger P, Miethsam B Conference contribution, Conference Contribution Evaluation of Mechanical Stress on Electronic Assemblies during Thermoforming and Injection Molding for Conformable Electronics (2021) Schirmer J, Reichenberger M, Wimmer A, Reichel H, Neermann S, Franke J Conference contribution