Technische Universität Dresden

Electronically driven single-molecule switch on silicon dangling bonds (2016) Nickel A, Lehmann T, Meyer J, Eisenhut F, Ohmann R, Ryndyk DA, Joachim C, et al. Journal article HPV status, cancer stem cell marker expression, hypoxia gene signatures and tumour volume identify good prognosis subgroups in patients with HNSCC after primary radiochemotherapy: A multicentre retrospective study of the German Cancer Consortium Radiation Oncology Group (DKTK-ROG) (2016) Linge A, Lohaus F, Loeck S, Nowak A, Gudziol V, Valentini C, Von Neubeck C, et al. Journal article Synthesis of Graphene Nanoribbons by Ambient-Pressure Chemical Vapor Deposition and Device Integration (2016) Chen Z, Zhang W, Palma CA, Rizzini AL, Liu B, Abbas A, Richter N, et al. Journal article High-Sensitivity Troponin T and Mortality After Elective Percutaneous Coronary Intervention (2016) Ndrepepa G, Colleran R, Braun S, Cassese S, Hieber J, Fusaro M, Kufner S, et al. Journal article SecureKeeper: Confidential ZooKeeper using Intel SGX (2016) Brenner S, Wulf C, Goltzsche D, Weichbrodt N, Lorenz M, Fetzer C, Pietzuch P, Kapitza R Conference contribution Wafer-sized multifunctional polyimine-based two-dimensional conjugated polymers with high mechanical stiffness (2016) Sahabudeen H, Qi H, Glatz BA, Tranca D, Dong R, Hou Y, Zhang T, et al. Journal article Confined Catalytic Janus Swimmers in a Crowded Channel: Geometry-Driven Rectification Transients and Directional Locking (2016) Yu H, Kopach A, Misko VR, Vasylenko AA, Makarov D, Marchesoni F, Nori F, et al. Journal article Probing Silica-Biomolecule Interactions by Solid-State NMR and Molecular Dynamics Simulations (2016) Brueckner SI, Donets S, Dianat A, Bobeth M, Gutierrez R, Cuniberti G, Brunner E Journal article Nucleosomal arrangement affects single-molecule transcription dynamics (2016) Fitz V, Shin J, Ehrlich C, Farnung L, Cramer P, Zaburdaev V, Grill SW Journal article In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications (2016) Windrich F, Kappert EJ, Malanin M, Eichhorn KJ, Haeussler L, Benes NE, Voit B Journal article