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Institute Materials for Electronics and Energy Technology (i-MEET)
Friedrich-Alexander-Universität Erlangen-Nürnberg
Technische Fakultät
Department Werkstoffwissenschaften
Overview
Publications
(1,419)
Research Grants
(36)
Research Fields
(3)
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Journal article
Journal article
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Book chapter / Article in edited volumes
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Influence of the Size Distribution of the SiC Powder Source on the Shape of the Crystal Growth Interface during PVT Growth of 4H-SiC Boules (2024)
Schultheiß J, Ihle J, Nanot SU, Bonanomi S, Munoz DC, Hammer R, Wellmann P
Book chapter / Article in edited volumes
Experimental design of (Cs,Rb)2Sn(Bi)Cl6 blue phosphors by cation-substitution-induced lattice strain (2024)
Stroyuk O, Raievska O, Daum M, Kupfer C, Osvet A, Hauch J, Brabec C
Journal article
Crystal Damage and Surface Morphology in Industrial Diamond Wire Slicing of 300 mm Monocrystalline Silicon Wafers for Microelectronic Devices (2024)
Oberhans S, Heiß W, Pietsch GJ
Journal article
Simulation of perovskite thin layer crystallization with varying evaporation rates (2024)
Majewski M, Qiu S, Ronsin O, Lüer L, Le Corre VM, Du T, Brabec C, et al.
Journal article
A matter of design and coupling: high indoor charging efficiencies with organic solar modules directly coupled to a sodium ion battery (2024)
Kin LC, Distler A, Astakhov O, Kone B, Kungl H, Karl A, Merdzhanova T, et al.
Journal article
Molecular Design of Hole Transport Materials to Immobilize Ion Motion for Photostable Perovskite Solar Cells (2024)
Zhang Z, Duan C, Wang S, Xie T, Zou F, Luo Y, Tang R, et al.
Journal article
A polymer bilayer hole transporting layer architecture for high-efficiency and stable organic solar cells (2024)
Xu J, Heumüller T, Le Corre VM, Barabash A, Félix R, Frisch J, Bär M, Brabec C
Journal article
Roll-to-Roll Deposition of Wide-Bandgap CsFAPbBr3 Perovskite Solar Cells in Ambient Air with Optimized Ink Formulation (2024)
Jafarzadeh F, Dong L, Jang D, Wagner M, Koch G, Qiu S, Feroze S, et al.
Journal article
How Intermodal Interaction Affects the Performance of Deep Multimodal Fusion for Mixed-Type Time Series (2024)
Dietz S, Altstidl TR, Zanca D, Eskofier B, Nguyen A
Conference contribution, Conference Contribution
Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024)
Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J
Conference contribution
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