Department Elektrotechnik-Elektronik-Informationstechnik (EEI)

Flip-Chip Integration of Power HEMTs: A Step Towards a GaN MMIC Technology (2003) Seemann K, Ramberger S, Tessmann A, Quay R, Schneider J, Rießle M, Walcher H, et al. Conference contribution 160 Gbit/s DPSK Transmission over 410 km Dispersion-Managed Fiber (2003) Ludwig R, Ferber S, Schubert C, Börner C, Beling A, Bach H, Schmauß B, et al. Conference contribution Einführung in die Systemtheorie, 2. Auflage (2003) Girod B, Rabenstein R, Stenger A Authored book, Textbook Radio Frequency Integrated Circuit System Design for UMTS Terminal Receivers (2003) Weigel R, Springer A, Maurer L Journal article Systematic Quality Assessment of Schottky Diodes for THz-Applications (2003) Biber S, Cojocari O, Mottet B, Rehm G, Schmidt LP Conference contribution Parasitic Effects in Broadband Chip Modules Based on Multilayer LTCC Technology (2003) Nisznansky M, Ziegler C, Schür J, Schmidt LP, Hocke R, Wohlgemuth O Conference contribution Influence of Antenna Shape and Resist Patterns on Charging Damage During Ion Implantation (2003) Dirnecker T, Frey L, Bauer A, Ryssel H, Ruf A, Henke D, Beyer A Conference contribution Technisch-wirtschaftliche Auswirkungen der zunehmenden Windenergieeinspeisung auf die Übertragungsnetzbetreiber (2003) Luther M Journal article Comparison of DPSK and OOK Modulation Format in 160 Gbit/s Transmission Systems (2003) Ferber S, Ludwig E, Börner B, Wietfeld A, Schmauß B, Berger J, Schubert C, et al. Journal article A Comprehensive Experimental Characterization of a Far Infrared Ring Laser (2003) Biber S, Schulz R, Beyer M, Schmidt LP Journal article