Department Elektrotechnik-Elektronik-Informationstechnik (EEI)


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Modelling and Construction of Complex Shaped Polyvinyl Alcohol based Ultrasound Phantoms for Inverse Magnetomotive Ultrasound Imaging (2024) Heim C, Huber C, Ermert H, Ullmann I, Saleem T, Lyer S, Rupitsch SJ Conference contribution, Conference Contribution Magnetically Enhanced Ultrasound Strain Elastography to Visualize Magnetic Nanoparticles (2024) Huber C, Müller MS, Ermert H, Heim C, Rupitsch SJ, Ullmann I, Lyer S Conference contribution, Conference Contribution Infrastructure-based Perception with Cameras and Radars for Cooperative Driving Scenarios (2024) Tsaregorodtsev A, Buchholz M, Belagiannis V Conference contribution Simplifying Random Particle Structures within Soft Magnetic Composite Materials for the Optimization of 3D-FEM Simulations (2024) Stolzke T, Schwarz J, März M Journal article Discovery of Molecular Intermediates and Nonclassical Nanoparticle Formation Mechanisms by Liquid Phase Electron Microscopy and Reaction Throughput Analysis (2024) Sun J, Fritsch B, Körner A, Taherkhani M, Park C, Wang M, Hutzler A, Woehl TJ Journal article Modelling postural control of upright standing during translational perturbations (2024) Shanbhag J, Fleischmann S, Gaßner H, Winkler J, Eskofier B, Koelewijn A, Wartzack S, Miehling J Conference contribution, Abstract of a poster GP-based modeling for PSD control of emulsification processes (2024) Südhoff T, Ebner L, Schmidt J, Graichen K Conference contribution Side-Slip Compensation in Model Predictive Path Following Control for General-n-Trailer Systems (2024) Kögler P, Dahlmann J, Graichen K Conference contribution Trajectory tracking control for multilevel pressure boosting systems (2024) Goppelt-Schneider F, Schmidt-Vollus R, Graichen K Conference contribution A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs (2024) Pfahler T, Scheder A, Bridier A, Nagel M, Vossiek M Journal article