Advancing Microelectronics

ISSN: 2222-8748
Publisher: International Microelectronics and Packaging Society

Publications (3)

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Journal article
Unpublished / Preprint

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Abstract

Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules (2024) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Journal article Additive metallization of alumina with copper-titanium powder blends for power electronic applications (2023) Hecht C, Häußler F, Schadow E, Stoll T, Sprenger M, Franke J Journal article Location dependent down-rating of voids in high power solder connections for automotive power modules (2022) Ottinger B, Murk S, König S, Zangarro A, Müllmaier M, Müller L, Franke J Conference contribution