Microelectronic Engineering
Journal Abbreviation: MICROELECTRON ENG
ISSN: 0167-9317
Publisher: Elsevier
Publications (37)
Fabrication of metallic SPM tips by combining UV nanoimprint lithography and focused ion beam processing (2010)
Jambreck JD, Schmitt H, Amon B, Rommel M, Bauer AJ, Frey L
Journal article, Original article
A model of self-limiting residual acid diffusion for pattern doubling (2009)
Erdmann A, Fuhrmann J, Fiebach A, Uhle M, Szmanda C, Truong C
Journal article
Rigorous diffraction simulations of topographic wafer stacks in double patterning (2009)
Shao F, Evanschitzky P, Fühner T, Erdmann A
Journal article
Advanced lithography models for strict process control in the 32nm technology node (2009)
Patsis GP, Drygiannakis D, Raptis T, Gogoliddes E, Erdmann A
Journal article
Lanthanum implantation for threshold voltage control in metal/high-k devices (2009)
Fet A, Haeublein V, Bauer AJ, Ryssel H, Frey L
Journal article, Original article
Comparative study between conventional macroscopic IV techniques and advanced AFM based methods for electrical characterization of dielectrics at the nanoscale (2009)
Yanev V, Erlbacher T, Rommel M, Bauer AJ, Frey L
Journal article, Original article
Improved manufacturability of ZrO2 MIM capacitors by process stabilizing HfO2 addition (2009)
Mueller J, Boescke TS, Schroeder U, Reinicke M, Oberbeck L, Zhou D, Weinreich W, et al.
Journal article, Original article
Simulation of ion beam direct structuring for 3D nanoimprint template fabrication (2006)
Lugstein A, Frey L, Bertagnolli E, Platzgummer E, Biedermann A, Langfischer H, Eder-Kapl S, et al.
Journal article, Original article
Characterization of interface state densitiesby photocurrent analysis: Comparison of results for different insulator layers (2005)
Rommel M, Groß M, Ettinger A, Lemberger M, Bauer A, Frey L, Ryssel H
Journal article, Original article
Electrical characterization and reliability aspects of zirconium silicate films obtained from novel MOCVD precursors (2004)
Lemberger M, Paskaleva A, Zürcher S, Bauer A, Frey L, Ryssel H
Journal article, Original article