Advanced Materials Technologies
ISSN: 2365-709X
Publisher: Wiley
Publications (26)
Electrophotographic Powder Application for Surface Functionalization of Polymer Parts with Thin Silver‐Nanoadditivated Bactericidal Layers (2025)
Kricke JL, Ebert N, Sorarrain A, Roth S, Fischer D, Schmidt M, Gökce B, et al.
Journal article
Growth Factor-Loaded Mesoporous Silica Particles, Incorporated in Electrospun PCL Fibres, Provide Topographical and Chemical Cues for Tendon Tissue Engineering (2025)
Citro V, Clerici M, Shephard MT, Dale TP, Boccaccini AR, Forsyth NR
Journal article
Safety Through Visibility: Tracing Hydrogen in Colors with Highly Customizable and Flexibly Applicable Supraparticle Additives (2024)
Reichstein J, Groppe P, Stockinger N, Cuadrado Collados C, Thommes M, Wintzheimer S, Mandel K
Journal article
Very High Temperature Hall Sensors in a Wafer-Scale 4H-SiC Technology (2024)
Okeil H, Erlbacher T, Wachutka G
Journal article
Recent Developments in Halide Perovskite Nanocrystals for Indirect X-ray Detection (2024)
Balitskii O, Sytnyk M, Heiß W
Journal article, Review article
Fabrication and Characterization of a Magnetic 3D-printed Microactuator (2024)
Rothermel F, Thiele S, Jung C, Krapf A, Ilse SE, Merle B, Giessen H, Herkommer AM
Journal article
Crystal Damage and Surface Morphology in Industrial Diamond Wire Slicing of 300 mm Monocrystalline Silicon Wafers for Microelectronic Devices (2024)
Oberhans S, Heiß W, Pietsch GJ
Journal article
Plug-and-Play Multimaterial Chaotic Printing/Bioprinting to Produce Radial and Axial Micropatterns in Hydrogel Filaments (2023)
Ceballos-González CF, Bolívar-Monsalve EJ, Quevedo-Moreno DA, Chávez-Madero C, Velásquez-Marín S, Lam-Aguilar LL, Solís-Pérez ÓE, et al.
Journal article
Review and Prospects of PEM Water Electrolysis at Elevated Temperature Operation (2023)
Bonanno M, Müller K, Bensmann B, Hanke-Rauschenbach R, Aili D, Franken T, Chromik A, et al.
Journal article, Review article
Review on Electrospun Conductive Polymer Composites Strain Sensors (2023)
Wang X, Gao Q, Schubert DW, Liu X
Journal article, Review article