FEI Helios NanoLab 660 (FEI)
Model: Helios NanoLab660
Manufacturer: FEI (2013)
URL: https://www.em.tf.fau.de/research/equipment/helios-nanolab-660/
Location: Erlangen
Usage: For external users too
Pictures
DFG Key: 5120 Rasterelektronenmikroskope (für Remission) (REM)
Feature(s)
- Ultra-high resolution ElstarTM electron column with monochromator
- Resolution ~1 nm at 1-30 kV
- Retractable STEM and different SE & BSE detectors for advanced imaging contrasts
- High-resolution TomahawkTM ion column
- Gas Injection System for Pt, C and XeF2
- EasyLift NanoManipulator
- Kleindiek micromanipulator
- Oxford X-MaxN EDX detector (150 mm2 SDD)
- In-chamber plasma cleaner
Description
The FEI Helios NanoLab 660 dualbeam System combines ultra-high
resolution SEM imaging with extremely precise FIB milling. Having 8
different detectors, the instrument is capable of resolving a large
variety of signals like secondary electrons, x-rays, and secondary ions.
Using the Ga-ion FIB material can be removed with nanometer precision
to prepare site-specific cross-sections, TEM lamellae or structures for
mechanical tests. Three different gas injection systems are available
that can be used for different purposes. Carbon and Platinum can be
deposited in order to protect a surface or to do circuit editing, while
XeF2 can be used for ion-less milling of certain materials.
In addition Two micro-manipulators are available for lift-out
procedures, sample transfers and mechanical or electrical probing.
Involved Person(s)
Organisation(s)
Funding Sources
- Ultra-high resolution ElstarTM electron column with monochromator
- Resolution ~1 nm at 1-30 kV
- Retractable STEM and different SE & BSE detectors for advanced imaging contrasts
- High-resolution TomahawkTM ion column
- Gas Injection System for Pt, C and XeF2
- EasyLift NanoManipulator
- Kleindiek micromanipulator
- Oxford X-MaxN EDX detector (150 mm2 SDD)
- In-chamber plasma cleaner
The FEI Helios NanoLab 660 dualbeam System combines ultra-high resolution SEM imaging with extremely precise FIB milling. Having 8 different detectors, the instrument is capable of resolving a large variety of signals like secondary electrons, x-rays, and secondary ions. Using the Ga-ion FIB material can be removed with nanometer precision to prepare site-specific cross-sections, TEM lamellae or structures for mechanical tests. Three different gas injection systems are available that can be used for different purposes. Carbon and Platinum can be deposited in order to protect a surface or to do circuit editing, while XeF2 can be used for ion-less milling of certain materials. In addition Two micro-manipulators are available for lift-out procedures, sample transfers and mechanical or electrical probing.