Simulating memristive systems in mixed-signal mode using commercial design tools

Fritscher M, Knödtel J, Reichenbach M, Fey D (2019)

Publication Type: Conference contribution

Publication year: 2019

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 225-228

Conference Proceedings Title: 2019 26th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2019

Event location: Genoa IT

ISBN: 9781728109961

DOI: 10.1109/ICECS46596.2019.8964856

Abstract

In this paper a new simulation environment for memristive systems using commercial design tools will be presented. The method works across different levels of hardware abstraction (system level, RT-level, circuit level and device level), which allows to evaluate high-level systems properties by changing low-level device features. Our proposed method is using Cadence irun simulation flow, by exploiting Cadence Incisive and Cadence Spectre to enable mixed-signal simulation. As proof-of-concept we are able to simulate a complete RISC-V based CPU on digital level with memristor-based non-volatile flip-flops on the device level, with a throughput of 1.2 instructions/second simulation speed on a modern simulation server.

Authors with CRIS profile

Johannes Knödtel Lehrstuhl für Informatik 3 (Rechnerarchitektur) Marc Reichenbach Lehrstuhl für Informatik 3 (Rechnerarchitektur) Dietmar Fey Lehrstuhl für Informatik 3 (Rechnerarchitektur)

How to cite

APA:

Fritscher, M., Knödtel, J., Reichenbach, M., & Fey, D. (2019). Simulating memristive systems in mixed-signal mode using commercial design tools. In 2019 26th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2019 (pp. 225-228). Genoa, IT: Institute of Electrical and Electronics Engineers Inc..

MLA:

Fritscher, Markus, et al. "Simulating memristive systems in mixed-signal mode using commercial design tools." Proceedings of the 26th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2019, Genoa Institute of Electrical and Electronics Engineers Inc., 2019. 225-228.

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