Design considerations for the hot embossing of microstrip antennas on plastic foils

Kilian A, Fuchs M, Schmidt LP (2009)


Publication Language: English

Publication Type: Journal article

Publication year: 2009

Journal

Publisher: Cambridge University Press

Book Volume: 1(4)

Pages Range: 249-254

DOI: 10.1017/S1759078709990213

Abstract

In this contribution, fundamental design considerations for a novel metallization technique to realize millimeter-wave microstrip structures are presented. This hot embossing technology is a fast and economic process originating from the production of three-dimensional molded interconnect devices. Conductive structures are coated onto plastic parts or plastic foils using a heated stamp. This approach shows high potential and therefore will be investigated for the fabrication of low-cost printed antennas at millimeter-wave frequencies. The focus of this contribution is on design guidelines considering process parameters and interactions with substrate and copper foil characteristics derived from the fabrication and measurement of single microstrip patch antenna prototypes for radar applications in the industrial, scientific and medical (ISM) band at 24GHz. Far-reaching potential lies in the utilization of the three-dimensional manufacturing technology for the construction of conformal integrated antenna systems based on the thermoforming capabilities of polymer substrates. © 2009 Cambridge University Press and the European Microwave Association.

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How to cite

APA:

Kilian, A., Fuchs, M., & Schmidt, L.-P. (2009). Design considerations for the hot embossing of microstrip antennas on plastic foils. International Journal of Microwave and Wireless Technologies, 1(4), 249-254. https://dx.doi.org/10.1017/S1759078709990213

MLA:

Kilian, Andreas, Manuel Fuchs, and Lorenz-Peter Schmidt. "Design considerations for the hot embossing of microstrip antennas on plastic foils." International Journal of Microwave and Wireless Technologies 1(4) (2009): 249-254.

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