System Integration of Tightly-Coupled Reconfigurable Processor Arrays and Evaluation of Buffer Size Effects on Their Performance

Lari V, Hannig F, Teich J (2009)


Publication Type: Conference contribution

Publication year: 2009

Edited Volumes: Proceedings of the International Conference on Parallel Processing Workshops

Pages Range: 528-534

Conference Proceedings Title: Proceedings of the 4th International Symposium on Embedded Multicore Systems-on-Chip

Event location: Vienna AT

DOI: 10.1109/ICPPW.2009.72

Abstract

This paper studies the loosely integration of application accelerators consisting of an array of tightly-coupled lightweight reconfigurable processors into a system-on-a-chip. In order to explore a multitude of design variations a C++ simulation model of the accelerator has been integrated with a system-on-a-chip environment consisting of a general purpose processor, a DMA controller, an interrupt controller and a memory module. Dependent on the applications, different kinds of I/O buffers are designed around the processor array and the effects of the buffer size on the overall execution time are evaluated. The evaluations are based on new mathematical estimation models derived from the system and application constraints. The estimations are validated with experimental results with an error less than 1%. Exploring several designs points that using our architecture along with suitable buffer sizes, can improve the system execution time, one to two magnitudes for the selected algorithms. © 2009 IEEE.

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How to cite

APA:

Lari, V., Hannig, F., & Teich, J. (2009). System Integration of Tightly-Coupled Reconfigurable Processor Arrays and Evaluation of Buffer Size Effects on Their Performance. In Proceedings of the 4th International Symposium on Embedded Multicore Systems-on-Chip (pp. 528-534). Vienna, AT.

MLA:

Lari, Vahid, Frank Hannig, and Jürgen Teich. "System Integration of Tightly-Coupled Reconfigurable Processor Arrays and Evaluation of Buffer Size Effects on Their Performance." Proceedings of the 4th International Symposium on Embedded Multicore Systems-on-Chip (MCSoC), Vienna 2009. 528-534.

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