Syed Khaja AH, Schwarz D, Franke J (2015)
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Publication year: 2015
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 156-159
Article Number: 7357402
ISBN: 9781479988150
DOI: 10.1109/ICSJ.2015.7357402
Additive manufacturing is one of the key technologies which poses as an energy and resource efficient alternative of conventional subtractive and formative technologies. In this contribution, additive layered manufacturing mainly selective laser melting (SLM) is investigated to check the potential for system integration and packaging concepts. This paper gives an overview on the limitations of conventional molded integrated devices for high temperature applications. For high temperature stability, ceramic substrates were additively functionalized with copper based powder material using SLM technique. Focus of the work lies in the melting of the metal powder directly on ceramic substrate and producing a reliable metal-ceramic bond. The process influencing parameters such as laser power, velocity, scan concepts were tested to check the bonding characteristics. Initial shear tests and current carrying tests were performed to check the mechanical and electrical stability. The proof-of-concept was demonstrated by developing a prototype in automotive lighting application. The potential of SLM for high-temperature applicability is further discussed.
APA:
Syed Khaja, A.H., Schwarz, D., & Franke, J. (2015). Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications. In Proceedings of the IEEE CPMT Symposium Japan 2015, ICSJ 2015 (pp. 156-159). Institute of Electrical and Electronics Engineers Inc..
MLA:
Syed Khaja, Aarief Hussain, Daniel Schwarz, and Jörg Franke. "Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications." Proceedings of the IEEE CPMT Symposium Japan 2015, ICSJ 2015 Institute of Electrical and Electronics Engineers Inc., 2015. 156-159.
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