Thickness and grain size dependence of the strength of copper thin films as investigated with bulge tests and nanoindentations

Merle B, Schweitzer E, Göken M (2012)

Publication Type: Journal article

Publication year: 2012

Journal

Philosophical Magazine Taylor & Francis

Book Volume: 92

Pages Range: 3172-3187

Journal Issue: 25-27

DOI: 10.1080/14786435.2012.685773

Abstract

Thin films have often been reported to exhibit increased strength compared to their bulk counterparts. In this study, copper films with a thickness ranging from 400 to 2400 nm were investigated via bulge testing and nanoindentation, focusing on the influence of thickness and microstructure on the mechanical properties. Bulge tests on freestanding membranes show that the yield strength follows Hall--Petch behaviour, as bulk materials do. This also holds true for films on a substrate, as long as the microstructure contains several grains in the thickness direction. The determined Hall--Petch coefficient of 0.16 MPa m$-$1/2 is also similar to bulk materials. Texture was found to have very limited influence on mechanical behaviour. Nanoindentation data, evaluated by the Han--Nix method, showed that the hardness of thin films is higher than that of bulk materials with the same grain size.

Authors with CRIS profile

Benoit Merle Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften) Mathias Göken Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)

Additional Organisation(s)

Exzellenz-Cluster Engineering of Advanced Materials Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)

Related research project(s)

In-situ nanomechanics and FIB tomography of thin films (EXC315 EAM (A2-3)) Exzellenz-Cluster Engineering of Advanced Materials Nov. 1, 2012 - Oct. 31, 2017

How to cite

APA:

Merle, B., Schweitzer, E., & Göken, M. (2012). Thickness and grain size dependence of the strength of copper thin films as investigated with bulge tests and nanoindentations. Philosophical Magazine, 92(25-27), 3172-3187. https://dx.doi.org/10.1080/14786435.2012.685773

MLA:

Merle, Benoit, Elmar Schweitzer, and Mathias Göken. "Thickness and grain size dependence of the strength of copper thin films as investigated with bulge tests and nanoindentations." Philosophical Magazine 92.25-27 (2012): 3172-3187.

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