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Differential wideband interconnects for organic millimeter wave chip packages - An effort to design an all-purpose RF chip package

Röhrl FX, Bogner W, Jakob J, Hageneder D, Zorn S (2016)

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Publication Language: English

Publication Type: Conference contribution

Publication year: 2016

Publisher: IEEE

Event location: London

URI: http://ieeexplore.ieee.org/document/7824631/

DOI: 10.1109/EuMC.2016.7824631

Open Access Link: http://ieeexplore.ieee.org/document/7824631/

Abstract

In this paper a chip package is presented that is optimized for high operation frequencies and high power applications with a moderate number of signal paths. Using standard printed circuit board (PCB) materials, the package is also very cost effective. For radio frequency (RF) applications, the connection between chip and package is as important as the connection between package and baseboard. This paper presents both and shows that the package-baseboard transition is dominating the insertion and return loss at frequencies above 40 GHz, when using organic PCBs as base for the packages. Moreover, some methods are introduced to simplify the simulation models of organic PCB transitions. Because of the fully impedance controlled design process, the presented transitions can be used from DC to 67 GHz and ensure best signal integrity.

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How to cite

APA:

Röhrl, F.X., Bogner, W., Jakob, J., Hageneder, D., & Zorn, S. (2016). Differential wideband interconnects for organic millimeter wave chip packages - An effort to design an all-purpose RF chip package. London, GB: IEEE.

MLA:

Röhrl, Franz Xaver, et al. "Differential wideband interconnects for organic millimeter wave chip packages - An effort to design an all-purpose RF chip package." London IEEE, 2016.

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