Dimensioning and Comparison of Common Compensation Topologies for IPT Systems

Trautmann M, Ohlendorf M, Sanftl B, Weigel R, Kölpin A (2017)

Publication Status: In press

Publication Type: Conference contribution, Conference Contribution

Future Publication Type: Conference contribution

Publication year: 2017

Pages Range: 1-4

Conference Proceedings Title: 2017 IEEE International Symposium on Circuits and Systems (ISCAS)

Event location: Baltimore, MD

DOI: 10.1109/ISCAS.2017.8050511

Abstract

This paper presents the dimensioning as well as the comparison of common compensation topologies for inductive power transfer (IPT) systems. A compensation is needed on the primary as well as the secondary side. It consists of a capacitor (parallel or series) in the simplest case or a combination of reactive components (like LCC). This work is the first compilation of the dimensioning, considering all potential combinations of these three compensation possibilities. The five most promising solutions are simulated and the results are compared for constant current- and voltage-operation with varying loads as well as different coupling factors. Finally the different topologies are compared by selected criteria and evaluated accordingly.

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How to cite

APA:

Trautmann, M., Ohlendorf, M., Sanftl, B., Weigel, R., & Kölpin, A. (2017). Dimensioning and Comparison of Common Compensation Topologies for IPT Systems. In 2017 IEEE International Symposium on Circuits and Systems (ISCAS) (pp. 1-4). Baltimore, MD, US.

MLA:

Trautmann, Martin, et al. "Dimensioning and Comparison of Common Compensation Topologies for IPT Systems." Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), Baltimore, MD 2017. 1-4.

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