Maupai S, Dakkouri AS, Stratmann M, Schmuki P (2003)
Publication Status: Published
Publication Type: Journal article, Original article
Publication year: 2003
Publisher: Electrochemical Society
Book Volume: 150
Pages Range: C111-C114
Journal Issue: 3
DOI: 10.1149/1.1541007
Tip-induced metal deposition was employed to fabricate nanometer sized Cu clusters on AuCu(001) electrodes using an electrochemical scanning tunneling microscope (EC-STM). Due to the mixed Au and Cu termination of the substrate surface, an underpotential deposition (UPD) layer of copper covers only Au sites. Investigation of the anodic oxidation and dissolution of the Cu clusters give evidence for a strong inhibition of surface diffusion reactions due to this partial UPD layer. Based on a comparison of the nanocluster dissolution behavior with dealloying reactions of the substrate, it is concluded, that the nanostructures consist of a mixture between copper and gold due to interfacial alloying effects. This offers a novel explanation for the unexpected and unusually high stability of the clusters frequently reported in literature.
APA:
Maupai, S., Dakkouri, A.S., Stratmann, M., & Schmuki, P. (2003). Tip-induced nanostructuring of Au3Cu(001) with an electrochemical scanning tunneling microscope. Journal of The Electrochemical Society, 150(3), C111-C114. https://dx.doi.org/10.1149/1.1541007
MLA:
Maupai, Stefan, et al. "Tip-induced nanostructuring of Au3Cu(001) with an electrochemical scanning tunneling microscope." Journal of The Electrochemical Society 150.3 (2003): C111-C114.
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