Conference contribution


Connecting Different Worlds - Technology Abstraction for Reliability-Aware Design and Test


Publication Details
Author(s): Schlichtmann U, Kleeberger VB, Abraham JA, Evans A, Gimmler-Dumon C, Glaß M, Herkersdorf A, Nassif SR, Wehn N
Title edited volumes: Proceedings -Design, Automation and Test in Europe, DATE
Publisher: IEEE Press
Publishing place: New York, NY, USA
Publication year: 2014
Conference Proceedings Title: Proc. of Design, Automation and Test in Europe (DATE)
Pages range: 8
ISBN: 978-3-9815370-2-4
ISSN: 1530-1591

Event details
Event: Design, Automation and Test in Europe (DATE)
Event location: Dresden
Start date of the event: 24/03/2014
End date of the event: 28/03/2014

Abstract

The rapid shrinking of device geometries in the nanometer regime requires new technology-aware design methodologies. These must be able to evaluate the resilience of the circuit throughout all System on Chip (SoC) abstraction levels. To successfully guide design decisions at the system level, reliability models, which abstract technology information, are required to identify those parts of the system where additional protection in the form of hardware or software coun-termeasures is most effective. Interfaces such as the presented Resilience Articulation Point (RAP) or the Reliability Interchange Information Format (RIIF) are required to enable EDA-assisted analysis and propagation of reliability information. The models are discussed from different perspectives, such as design and test. © 2014 EDAA.



How to cite
APA: Schlichtmann, U., Kleeberger, V.B., Abraham, J.A., Evans, A., Gimmler-Dumon, C., Glaß, M.,... Wehn, N. (2014). Connecting Different Worlds - Technology Abstraction for Reliability-Aware Design and Test. In Proc. of Design, Automation and Test in Europe (DATE) (pp. 8). Dresden: New York, NY, USA: IEEE Press.

MLA: Schlichtmann, Ulf, et al. "Connecting Different Worlds - Technology Abstraction for Reliability-Aware Design and Test." Proceedings of the Design, Automation and Test in Europe (DATE), Dresden New York, NY, USA: IEEE Press, 2014. 8.

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