Conference contribution
(Conference Contribution)


Electromagnetic field analysis with advanced structural modeling of microstrips on porosified LTCC


Publication Details
Author(s): Talai A, Weigel R, Kölpin A, Gmeiner B, Rüde U, Steinhäußer F, Bittner A, Schmid U
Title edited volumes: European Microwave Week 2013, EuMW 2013 - Conference Proceedings; EuMC 2013: 43rd European Microwave Conference
Publisher: IEEE
Publishing place: Nürnberg
Publication year: 2013
Conference Proceedings Title: Microwave Conference (EUMC), 2013 European
Pages range: 440-443

Event details
Event: European Microwave Conference
Event location: Nürnberg
Start date of the event: 07/10/2013
End date of the event: 10/10/2013
Language: English

Abstract

Recent investigations demonstrated that porosification offers the possibility of high quality antenna integration on LTCC by local reduction of the relative permittivity. In order to take advantage of this technology, further research for the deposition of conductors on porosified areas has to be done. Since the near-surface material removal is strong, conductors are expected to penetrate substantially into the porosified substrate. In this paper a new, randomized structural modeling technique of porosified LTCC is presented, which is based on scanning electron microscope imaging. Finite 3D field simulations, performed with this model, show the electromagnetic effects of different vertical microstrip positions on the effective permittivity and the corresponding scattering parameters. © 2013 European Microwave Association.



How to cite
APA: Talai, A., Weigel, R., Kölpin, A., Gmeiner, B., Rüde, U., Steinhäußer, F.,... Schmid, U. (2013). Electromagnetic field analysis with advanced structural modeling of microstrips on porosified LTCC. In Microwave Conference (EUMC), 2013 European (pp. 440-443). Nürnberg: IEEE.

MLA: Talai, Armin, et al. "Electromagnetic field analysis with advanced structural modeling of microstrips on porosified LTCC." Proceedings of the European Microwave Conference, Nürnberg Nürnberg: IEEE, 2013. 440-443.

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