Kaufmann S (2002)
Publication Type: Thesis
Publication year: 2002
Publisher: Meisenbach
Edited Volumes: Fertigungstechnik - Erlangen 126
A variety of optical and electro-optical components for telecommunications are based on silicon as a substrate or chip material. Both for new, innovative components and for the continuous improvement of existing products, laser-assisted joining technologies are of great importance for supplementing conventional joining processes. This book describes the basics of laser beam joining of silicon using Nd: YAG laser radiation. After discussing the beam-material interaction and the process method for blind spot welding, the laser-assisted fixing of glass fibers in silicon V-grooves for the coupling of glass fibers to optical components is presented. Another focal point is the laser beam welding of silicon substrates, whereby cracks in the component can be avoided by means of a laser-assisted preheating process.
APA:
Kaufmann, S. (2002). Grundlegende Untersuchungen zum Nd:YAG- Laserstrahlfügen von Silizium für Komponenten der Optoelektronik (Dissertation).
MLA:
Kaufmann, Stefan. Grundlegende Untersuchungen zum Nd:YAG- Laserstrahlfügen von Silizium für Komponenten der Optoelektronik. Dissertation, Meisenbach, 2002.
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