Medium-Level Architectures for Digital Twins: Bridging Conceptual Reference Architectures to Practical Implementation in Cloud, Edge and Cloud–Edge Deployments
Fett M, Kraft M, Wilking F, Götz S, Wartzack S, Kirchner E (2024)
Publication Type: Journal article
Publication year: 2024
Journal
Book Volume: 13
Pages Range: 1373
Issue: 7
DOI: 10.3390/electronics13071373
Abstract
The integration of Digital Twins (DTs) is becoming increasingly important in various industries. This entails the need for a comprehensive and practical IT infrastructure framework. This paper presents a modifiable medium-level architecture that serves as a link between established reference architectures such as RAMI 4.0 and the pragmatic implementation of Digital Twins. The functionalities of an IT infrastructure are considered, and functional hardware and software components for fulfilling these are described. The proposed architecture is suitable for various deployment scenarios, including local, cloud and hybrid cloud–edge configurations. In order to improve the applicability of the medium-level architecture, a step-by-step procedure is also proposed, which helps to transfer the overarching requirements for a Digital Twin into a suitable IT infrastructure. Finally, the results are demonstrated by an exemplary application to a two-stage industrial gearbox.
Authors with CRIS profile
Fabian Wilking
Chair of Engineering Design
Stefan Götz
Chair of Engineering Design
Sandro Wartzack
Chair of Engineering Design
Involved external institutions
Germany (DE)How to cite
APA:
Fett, M., Kraft, M., Wilking, F., Götz, S., Wartzack, S., & Kirchner, E. (2024). Medium-Level Architectures for Digital Twins: Bridging Conceptual Reference Architectures to Practical Implementation in Cloud, Edge and Cloud–Edge Deployments. Electronics, 13, 1373. https://doi.org/10.3390/electronics13071373
MLA:
Fett, Michel, et al. "Medium-Level Architectures for Digital Twins: Bridging Conceptual Reference Architectures to Practical Implementation in Cloud, Edge and Cloud–Edge Deployments." Electronics 13 (2024): 1373.
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