Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications

Hecht C, Schadow E, Sprenger M, Häußler F, Stoll T, Franke J (2023)


Publication Status: Published

Publication Type: Conference contribution, Conference Contribution

Publication year: 2023

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: IMAPSource Proceedings 2023 (EMPC)

Event location: Hinxton GB

ISBN: 9780956808691

DOI: 10.23919/EMPC55870.2023.10418396

Abstract

Additive manufacturing shows great potential to further increase the performance of power electronic modules through novel packaging concepts. Such an approach is the integrated manufacturing of metal-ceramic substrates by means of laser powder bed fusion of metals (PBF-LB/M). With this layered additive manufacturing process, planar ceramic substrates can be metallized and electrically functionalized for power electronic applications. In this paper Al2O3 ceramic substrates are metallized via PBF-LB/M by selectively melting applied powder layers with software defined geometries. The investigated powders are mixtures of copper and titanium powders with 1 wt.%, 5 wt.% and 10 wt.% titanium in order to enable bonding by creating a titanium-oxide reaction layer at the interface to the ceramic. Shear tests and microstructural investigations show that a subsequent heat treatment increases the adhesion and density of the metallization. By energy dispersive X-ray microscopy (EDX) the partial formation of reaction layers is detected.

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APA:

Hecht, C., Schadow, E., Sprenger, M., Häußler, F., Stoll, T., & Franke, J. (2023). Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications. In IMAPSource Proceedings 2023 (EMPC). Hinxton, GB: Institute of Electrical and Electronics Engineers Inc..

MLA:

Hecht, Christoph, et al. "Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications." Proceedings of the 24th European Microelectronics and Packaging Conference, EMPC 2023, Hinxton Institute of Electrical and Electronics Engineers Inc., 2023.

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