Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration
Latsch B, Dali OB, Chadda R, Schafer N, Altmann AA, Grimmer M, Beckerle P, Kupnik M (2023)
Publication Type: Conference contribution
Publication year: 2023
Journal
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: Proceedings of IEEE Sensors
Event location: Vienna, AUT
ISBN: 9798350303872
DOI: 10.1109/SENSORS56945.2023.10325114
Abstract
Attempts in research to equip robotic end-effectors with tactile sensing facilitate an advanced environment perception and provide the means for dexterous interaction. Sensing at the fingertips can be realized using force sensors. In this work, we present an additively manufactured universal force-sensor offering structural integration to accomplish fast adaptation to application-specific needs. The piezoresistive sensor consists of commercially available conductive polylactic acid (PLA). Its geometry is based on rigid PLA spring elements to overcome the inherent limitations of elastomers. A curved shape increases the length of the deformation element, thus, the sensitivity, while retaining the flexibility necessary to allow for a displacement-induced change of the electrical resistance. The sensor features an additional integrated spring, which enables the adaptation of the mechanical stiffness and therefore of the measurement range. We use thread-forming screws to achieve a robust and enduring electrical connection between wires and the conductive polymer. The characterization of the sensor takes place in a universal testing machine with an applied load up to 5 N. The resistance measured gives a nearly linear characteristic and is proportional to the displacement. We obtain a sensitivity of 6.5 Ohm/N and a relative change of resistance of 6%. Low creep (0.12%) during phases with constant load reveals an advanced geometry-induced mechanical behavior. Thus, our printed piezoresistive PLA sensor demonstrates the suitability of conductive rigid materials for their tailored application as force sensors in robotics.
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Germany (DE)How to cite
APA:
Latsch, B., Dali, O.B., Chadda, R., Schafer, N., Altmann, A.A., Grimmer, M.,... Kupnik, M. (2023). Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration. In Proceedings of IEEE Sensors. Vienna, AUT: Institute of Electrical and Electronics Engineers Inc..
MLA:
Latsch, Bastian, et al. "Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration." Proceedings of the 2023 IEEE SENSORS, SENSORS 2023, Vienna, AUT Institute of Electrical and Electronics Engineers Inc., 2023.
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