Hardware Design Challenges and Modulation Schemes in Joint Communication and Sensing

Faghih-Naini S, Sebastian C, Reißland T, Weigel R, Scheiner B (2024)

Publication Language: English

Publication Status: Published

Publication Type: Journal article, Review article

Future Publication Type: Journal article

Publication year: 2024

Journal

IEEE Microwave Magazine Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/MMM.2023.3341010

Authors with CRIS profile

Samira Faghih-Naini Lehrstuhl für Technische Elektronik Caroline Sebastian Lehrstuhl für Technische Elektronik Torsten Reißland Lehrstuhl für Elektrische Smart City-Systeme Robert Weigel Lehrstuhl für Technische Elektronik Benedict Scheiner Lehrstuhl für Technische Elektronik

Additional Organisation(s)

FAU Profilzentrum Licht.Materie.Quantentechnologien (FAU LMQ)

How to cite

APA:

Faghih-Naini, S., Sebastian, C., Reißland, T., Weigel, R., & Scheiner, B. (2024). Hardware Design Challenges and Modulation Schemes in Joint Communication and Sensing. IEEE Microwave Magazine. https://dx.doi.org/10.1109/MMM.2023.3341010

MLA:

Faghih-Naini, Samira, et al. "Hardware Design Challenges and Modulation Schemes in Joint Communication and Sensing." IEEE Microwave Magazine (2024).

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