Distribution of Modal Damping in Absorptive Shoebox Rooms
Schäfer M, Prawda K, Rabenstein R, Schlecht SJ (2023)
Publication Type: Conference contribution
Publication year: 2023
Publisher: Institute of Electrical and Electronics Engineers Inc.
Book Volume: 2023-October
Conference Proceedings Title: IEEE Workshop on Applications of Signal Processing to Audio and Acoustics
Event location: New Paltz, NY, USA
ISBN: 9798350323726
DOI: 10.1109/WASPAA58266.2023.10248145
Abstract
The image-source method is widely applied to compute room impulse responses (RIRs) of shoebox rooms with arbitrary damping. However, with increasing RIR lengths, the number of image sources grows rapidly, leading to slow computation. We propose a method to estimate the damping density of a damped shoebox room, which in turn can provide the energy decay necessary to model the stochastic late reverberation. The damping density is derived from a modal decomposition that is compliant with the ISM solution. We show that the proposed method gives a more accurate estimate of the energy decay than previous methods and can be efficiently computed regardless of the RIR lengths. While we focus on the derivation and evaluation, the main practical applications of the proposed model include, e.g., the faster synthesis of late reverb and the analysis of multi-slope decays.
Authors with CRIS profile
Maximilian Schäfer
Lehrstuhl für Digitale Übertragung
Rudolf Rabenstein
Lehrstuhl für Multimediakommunikation und Signalverarbeitung
Involved external institutions
Finland (FI)How to cite
APA:
Schäfer, M., Prawda, K., Rabenstein, R., & Schlecht, S.J. (2023). Distribution of Modal Damping in Absorptive Shoebox Rooms. In IEEE Workshop on Applications of Signal Processing to Audio and Acoustics. New Paltz, NY, USA: Institute of Electrical and Electronics Engineers Inc..
MLA:
Schäfer, Maximilian, et al. "Distribution of Modal Damping in Absorptive Shoebox Rooms." Proceedings of the 2023 IEEE Workshop on Applications of Signal Processing to Audio and Acoustics, WASPAA 2023, New Paltz, NY, USA Institute of Electrical and Electronics Engineers Inc., 2023.
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