Müller M, Franke J (2018)
Publication Type: Conference contribution
Publication year: 2018
Publisher: Institute of Electrical and Electronics Engineers Inc.
Book Volume: 2018-February
Pages Range: 1-5
Conference Proceedings Title: 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
Event location: Singapore, SGP
ISBN: 9781538630426
DOI: 10.1109/EPTC.2017.8277552
In the field of power electronics, assembly and interconnection technologies play an important role for the design of modules and systems. The applied packaging technologies largely determine the electrical, thermal and mechanical properties of the final module. In addition to conventional solder technology upcoming technologies like sintering, transient liquid phase soldering, adhesive bonding or even reactive multilayer materials are interesting methods for the realization of the die attach. [1] This paper is about a combination of sintering and adhesive bonding for the interconnection of power electronics components. As interconnection material a highly viscous conductive silver ink is used. Additionally also sensor structures were printed with the same silver ink to test the potentials for condition monitoring applications in the field of power electronics.
APA:
Müller, M., & Franke, J. (2018). Feasability study of piezo jet printed silver ink structures for interconnection and condition monitoring of power electronics components. In 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017 (pp. 1-5). Singapore, SGP: Institute of Electrical and Electronics Engineers Inc..
MLA:
Müller, Martin, and Jörg Franke. "Feasability study of piezo jet printed silver ink structures for interconnection and condition monitoring of power electronics components." Proceedings of the 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017, Singapore, SGP Institute of Electrical and Electronics Engineers Inc., 2018. 1-5.
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