Effects of Insulation Residues on the Contacting Process of Copper Flat Wire Connections
Kühl A (2022)
Publication Type: Conference contribution
Publication year: 2022
Publisher: IEEE
City/Town: NEW YORK
Pages Range: 112-119
Conference Proceedings Title: 2022 IEEE 67TH HOLM CONFERENCE ON ELECTRICAL CONTACTS (HLM)
Event location: Tampa, FL
DOI: 10.1109/hlm54538.2022.9969811
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How to cite
APA:
Kühl, A. (2022). Effects of Insulation Residues on the Contacting Process of Copper Flat Wire Connections. In 2022 IEEE 67TH HOLM CONFERENCE ON ELECTRICAL CONTACTS (HLM) (pp. 112-119). Tampa, FL, US: NEW YORK: IEEE.
MLA:
Kühl, Alexander. "Effects of Insulation Residues on the Contacting Process of Copper Flat Wire Connections." Proceedings of the IEEE 67th Holm Conference on Electrical Contacts (HLM), Tampa, FL NEW YORK: IEEE, 2022. 112-119.
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