Building blocks of a flip-chip integrated superconducting quantum processor

Kosen S, Li HX, Rommel M, Shiri D, Warren C, Gronberg L, Salonen J, Abad T, Biznarova J, Caputo M, Chen L, Grigoras K, Johansson G, Kockum AF, Krizan C, Lozano DP, Norris GJ, Osman A, Fernandez-Pendas J, Ronzani A, Roudsari AF, Simbierowicz S, Tancredi G, Wollraff A, Eichler C, Govenius J, Bylander J (2022)

Publication Type: Journal article

Publication year: 2022

Journal

Quantum Science and Technology IOP Publishing

Book Volume: 7

Article Number: 035018

Journal Issue: 3

DOI: 10.1088/2058-9565/ac734b

Abstract

We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips - one quantum chip and one control chip - that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

Authors with CRIS profile

Christopher Eichler

Involved external institutions

Eidgenössische Technische Hochschule Zürich (ETHZ) / Swiss Federal Institute of Technology in Zurich CH Switzerland (CH) VTT Technical Research Centre of Finland FI Finland (FI) Chalmers University of Technology / Chalmers tekniska högskola SE Sweden (SE)

How to cite

APA:

Kosen, S., Li, H.-X., Rommel, M., Shiri, D., Warren, C., Gronberg, L.,... Bylander, J. (2022). Building blocks of a flip-chip integrated superconducting quantum processor. Quantum Science and Technology, 7(3). https://dx.doi.org/10.1088/2058-9565/ac734b

MLA:

Kosen, Sandoko, et al. "Building blocks of a flip-chip integrated superconducting quantum processor." Quantum Science and Technology 7.3 (2022).

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