Michler F, Kolpak J, Scheiner B, Weigel R, Hagelauer A (2023)
Publication Language: English
Publication Status: Accepted
Publication Type: Conference contribution, Conference Contribution
Future Publication Type: Conference contribution
Publication year: 2023
Pages Range: 27-30
ISBN: 978-1-6654-9344-4
DOI: 10.1109/RWS55624.2023.10046309
APA:
Michler, F., Kolpak, J., Scheiner, B., Weigel, R., & Hagelauer, A. (2023). Characterization of a Flexible Polymer-Based Substrate Material for RF Applications. In Proceedings of the IEEE Radio and Wireless Symposium (RWS) (pp. 27-30). Las Vegas, NV, US.
MLA:
Michler, Fabian, et al. "Characterization of a Flexible Polymer-Based Substrate Material for RF Applications." Proceedings of the IEEE Radio and Wireless Symposium (RWS), Las Vegas, NV 2023. 27-30.
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