Characterization of a Flexible Polymer-Based Substrate Material for RF Applications

Michler F, Kolpak J, Scheiner B, Weigel R, Hagelauer A (2023)


Publication Language: English

Publication Status: Accepted

Publication Type: Conference contribution, Conference Contribution

Future Publication Type: Conference contribution

Publication year: 2023

Pages Range: 27-30

Event location: Las Vegas, NV US

ISBN: 978-1-6654-9344-4

DOI: 10.1109/RWS55624.2023.10046309

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How to cite

APA:

Michler, F., Kolpak, J., Scheiner, B., Weigel, R., & Hagelauer, A. (2023). Characterization of a Flexible Polymer-Based Substrate Material for RF Applications. In Proceedings of the IEEE Radio and Wireless Symposium (RWS) (pp. 27-30). Las Vegas, NV, US.

MLA:

Michler, Fabian, et al. "Characterization of a Flexible Polymer-Based Substrate Material for RF Applications." Proceedings of the IEEE Radio and Wireless Symposium (RWS), Las Vegas, NV 2023. 27-30.

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