Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing

Jiang F, Zhou M, Drummer D (2022)

Publication Type: Journal article

Publication year: 2022

Journal

Polymers MDPI

Book Volume: 14

Journal Issue: 15

DOI: 10.3390/polym14153107

Abstract

In this research, the effects of fumed silica (FS) on the Ultraviolet (UV)-ink rheological behavior and processing windows were discussed. Objects using different concentrations of FS inks were printed by the modified UV-Direct ink writing (DIW) printer. The function of fumed silica in the ink-based system has been verified, and the processing scope has been expended with a suitable amount of FS combined with the UV light. The results show that the combination of a suitable amount of FS with the UV-DIW system reaches fast and accurate printing with a larger processing window compared to the non-UV system. However, an excessively high concentration of FS will increase the yield stress of the ink, which also increases the requirement of extrusion unit and the die-swelling effects.

Authors with CRIS profile

Fengze Jiang Lehrstuhl für Kunststofftechnik (LKT) Dietmar Drummer Lehrstuhl für Kunststofftechnik (LKT)

Involved external institutions

Central South University CN China (CN)

How to cite

APA:

Jiang, F., Zhou, M., & Drummer, D. (2022). Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing. Polymers, 14(15). https://doi.org/10.3390/polym14153107

MLA:

Jiang, Fengze, Mingyong Zhou, and Dietmar Drummer. "Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing." Polymers 14.15 (2022).

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