Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation

Sprenger M, Forndran F, Ottinger B, Braun T, Franke J (2022)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2022

Publisher: VDE Verlag Gmbh

City/Town: Berlin and Offenbach

Pages Range: 88-93

Conference Proceedings Title: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022)

Event location: Berlin DE

ISBN: 978-3-8007-5757-2

Abstract

Standard automotive power modules with sixpack topology and highest power density rely on metal ceramic substrates, direct liquid cooling by copper heat sinks and soft encapsulation by silicone gel. This study assesses the influence of novel thick copper substrates (TCS), with copper metallization thicknesses up to 2 mm, aluminium heat sinks and hard encapsulation by epoxy potting on the thermal performance and reliability of a power module package.
Soft potted power modules based on AMB substrates soldered onto a copper heat sink are compared to soft and hard potted TCS based modules on an aluminium heat sink.
Thermal impedances Zth j-f of all three mentioned module types are determined by FEM simulation and validated against impedance values measured during power cycling. TCS modules (Zth j-fFEM = 0.19) show better performance than AMB modules (Zth j-fFEM = 0.27).
Resistance of the solder interconnection between substrate and heat sink against thermo-mechanical stress is assessed by thermal shock tests. All modules types are therein able to meet the requirements set for the increase in thermal resistance within ECPE Guideline AQG 324. Differences between AMB and TCS delamination characteristics and the beneficial influence of hard potting onto solder delamination are investigated by scanning acoustic microscopy (SAM).
The thermal shock experiments are accompanied by thermo-mechanical simulations for additional quantification of AMB, TCS, heat sink and epoxy potting influence on the accumulation of plastic strain in the soldered substrate attach, as well as the sintered die attach layer.

Authors with CRIS profile

Mario Sprenger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Bettina Ottinger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

Vitesco Technologies GmbH DE Germany (DE)

How to cite

APA:

Sprenger, M., Forndran, F., Ottinger, B., Braun, T., & Franke, J. (2022). Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation. In Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022) (pp. 88-93). Berlin, DE: Berlin and Offenbach: VDE Verlag Gmbh.

MLA:

Sprenger, Mario, et al. "Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation." Proceedings of the CIPS 2022, Berlin Berlin and Offenbach: VDE Verlag Gmbh, 2022. 88-93.

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