Long Term Reliability of Mechatronic Devices Generated by Fused Layer Modeling and Laser Assisted Sintering of Printed Structures
Niese B, Geisler B, Frick T, Roth S, Schmidt M (2018)
Publication Type: Conference contribution
Publication year: 2018
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2018 13th International Congress Molded Interconnect Devices, MID 2018
Event location: Wurzburg
ISBN: 9781538649336
DOI: 10.1109/ICMID.2018.8526980
Abstract
The generation of mechatronic integrated devices (MID) by means of direct printing technologies is a method for applying conductive structures flexibly on substrate carriers. By using additive manufacturing processes such as Fused Layer Modeling (FLM), it is possible to generate conductive circuits by means of laser assisted sintering of printed structures and to embed them in the matrix during the generation process. The multi-layer structure thus increases the functional density of the assemblies. In order to ensure safe and reliable operation of these mechatronic assemblies, the long-Term characteristics of the printed structures are determined by means of climate change tests and heatmoisture tests in this work. For an evaluation of characteristic properties, four point measurements and adhesions tests are carried out on the conductive structures. The results show that the technology is well suited for prototype and small series production.
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APA:
Niese, B., Geisler, B., Frick, T., Roth, S., & Schmidt, M. (2018). Long Term Reliability of Mechatronic Devices Generated by Fused Layer Modeling and Laser Assisted Sintering of Printed Structures. In 2018 13th International Congress Molded Interconnect Devices, MID 2018. Wurzburg, DE: Institute of Electrical and Electronics Engineers Inc..
MLA:
Niese, Bernd, et al. "Long Term Reliability of Mechatronic Devices Generated by Fused Layer Modeling and Laser Assisted Sintering of Printed Structures." Proceedings of the 13th International Congress Molded Interconnect Devices, MID 2018, Wurzburg Institute of Electrical and Electronics Engineers Inc., 2018.
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