Müller M, Hentschel O, Schmidt M, Franke J (2017)
Publication Type: Conference contribution
Publication year: 2017
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 602-605
Conference Proceedings Title: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
Event location: Singapore, SGP
ISBN: 9781509043682
DOI: 10.1109/EPTC.2016.7861551
Laser cladding allows for a fast, flexible and direct plotting of electric conductive structures on polymer based substrates. The surface of the substrate is selectively melted by a focused laser beam. Simultaneously, a metal powder is lead through a powder nozzle. This nozzle is oriented laterally or coaxially to the laser beam. As a result, a molten bath of substrate and powder material is created. After cooling and solidification a welding bead on the substrate surface is formed. With this generation of circuit traces mechatronic devices can be built up, especially for high current power electronic applications. In this paper copper circuit traces on polymere substrates, produced by laser cladding with powder injection are characterized for their optical, electrical and mechanical properties by measuring resistance, adhesive strengths and current-carrying capacity including the effects of simulated environmental influences.
APA:
Müller, M., Hentschel, O., Schmidt, M., & Franke, J. (2017). Copper circuit traces by laser cladding with powder injection for additive manufactured mechatronic devices. In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 (pp. 602-605). Singapore, SGP: Institute of Electrical and Electronics Engineers Inc..
MLA:
Müller, Martin, et al. "Copper circuit traces by laser cladding with powder injection for additive manufactured mechatronic devices." Proceedings of the 18th IEEE Electronics Packaging Technology Conference, EPTC 2016, Singapore, SGP Institute of Electrical and Electronics Engineers Inc., 2017. 602-605.
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