Grain boundary engineering in roll-bonded copper to overcome the strength-ductility dilemma
Taali S, Toroghinejad MR, Kuglstatter M, Höppel HW (2022)
Publication Type: Journal article
Publication year: 2022
Journal
Book Volume: 17
Pages Range: 3198-3204
DOI: 10.1016/j.jmrt.2022.02.032
Abstract
Copper sheets with graded and fine-grained (FG) microstructures were processed by accumulative roll bonding (ARB) and subsequent annealing to evaluate the effect of structural heterogeneities on the strength-ductility relationship. By an appropriate design of the individual ARB-process-steps, two types of graded structures (GSs) have been achieved where the grain size gradually changes from a more refined grain structure at the surface to a coarser one in the interior (CGC) or a coarser one at the surface to a finer one in the interior (FGC). For both types, the grains size gradually changes between 4 and 19 microns across the thickness of samples. In terms of the uniform tensile work, GSs exhibited a superior combination of strength and elongation owing to the heterodeformation induced strengthening. In addition to a good strain delocalization capability compared to their coarse-grained (CG) counterpart, the graded microstructures affect the crack paths in the non-uniform deformation regime.(c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
Authors with CRIS profile
Moritz Kuglstatter
Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)
Heinz Werner Höppel
Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)
Involved external institutions
Iran, Islamic Republic of (IR)How to cite
APA:
Taali, S., Toroghinejad, M.R., Kuglstatter, M., & Höppel, H.W. (2022). Grain boundary engineering in roll-bonded copper to overcome the strength-ductility dilemma. Journal of Materials Research and Technology, 17, 3198-3204. https://dx.doi.org/10.1016/j.jmrt.2022.02.032
MLA:
Taali, Saeed, et al. "Grain boundary engineering in roll-bonded copper to overcome the strength-ductility dilemma." Journal of Materials Research and Technology 17 (2022): 3198-3204.
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