Active Damping of Thin Film Shape Memory Alloy Devices

Ahmadi S, Jacob K, Wendler F, Padhy A, Kohl M (2021)


Publication Type: Journal article

Publication year: 2021

Journal

Book Volume: 20

Issue: 1

DOI: 10.1002/pamm.202000310

Abstract

The thermomechanical coupling in shape memory alloys (SMAs) provides an effective mechanism of vibration damping by a cyclic structural phase transition. Here, we present simulations for an active SMA damper device based on a polycrystalline film materials, in which active damping via the one-way shape memory effect is exploited. We apply an extension of a previously reported superelastic model, that combines transition state kinetics with a phase field approach for the case of shock loading. By this approach, we are able to describe the time-resolved active damping performance of the device in agreement with experimental results.

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How to cite

APA:

Ahmadi, S., Jacob, K., Wendler, F., Padhy, A., & Kohl, M. (2021). Active Damping of Thin Film Shape Memory Alloy Devices. Proceedings in Applied Mathematics and Mechanics, 20. https://doi.org/10.1002/pamm.202000310

MLA:

Ahmadi, Shahabeddin, et al. "Active Damping of Thin Film Shape Memory Alloy Devices." Proceedings in Applied Mathematics and Mechanics 20 (2021).

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